Microscale Heat Transfer Lab


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    The present work deals with the development a very novel and prototypical Micro Loop Heat Pipe (LHP) using the Coherent Porous Silicon (CPS) technology developed at the University of Cincinnati for different thermal and space applications. This thesis concentrates primarily on the MEMS issues while the other colleagues concentrate on the thermal modeling. The CPS technology has been successfully utilized to etch pores in n-type (100) single crystalline silicon to an etch depth ranging from 150 mìm to 230 mìm. Using this etch process a through-pore CPS sample wick was developed, which acts as a pump, taking advantage of the very high capillary pressure generated because of the smaller sized pores.

 

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